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RND 560-00171Solder Sn/Cu 0,7 FLUX B2.1  1.0 mm 500g                        

Solder Wire, Sn99.3/Cu0.7, 500 g, 1 mm

Alloy Sn99.3/Cu0.7
Flux B 2.1
Proportion of flux 2.5 %
Filler wire diameter 1 mm
Weight 500 g
Melting point +217 °C
  • General
    • Type
    • Soldering tin
    • Design
    • Roll
    • Assembly
    • Sn99.3 Cu0.7
  • Other
    • Specification
    • Lead-free with copper portion
  • Measures
    • Ø
    • 1.0 mm
  • Implementation
    • Content
    • 500 g
  • Electrical values
    • Melting point
    • 217