Product picture : Illustration similar

RND 560-00175Solder Sn/Ag0,3/Cu 0,7 FLUX B2.1  1.0 mm 100g          

Solder Wire, Sn99/Ag0.3/Cu0.7, 100 g, 0.7 mm

Alloy Sn99/Ag0.3/Cu0.7
Flux B 2.1
Proportion of flux 2.5 %
Filler wire diameter 0.7 mm
Weight 100 g
Melting point +217 °C
  • General
    • Type
    • Lötzinn
    • Design
    • Rolle
    • Assembly
    • Sn99 Ag0.3 Cu0.7
  • Other
    • Specification
    • bleifrei mit Silber- und Kupferanteil
  • Measures
    • Ø
    • 1.0 mm
  • Implementation
    • Content
    • 100 g
  • Electrical values
    • Melting point
    • 217